NEC Electronics now shipping the world’s smallest outline gate array devices in TFPBGA packages

NEC Electronics Corporation, the world's leading supplier of gate array ASICs, today released the tape fine-pitch ball grid array (TFPBGA) packages for its successful gate array ASIC series. The very small outline packages start at 4.38 mm edge length, making these the smallest gate array devices currently available.

Gate array ASICs are widely used in many market segments where they offer a cost-efficient alternative to numerous FPGA products. They are also preferred when it comes to implementing digital designs where the emphasis lies on short time to market. The TFPBGA packages are poised to make a significant impact on the space requirements of such designs.

Initially, the TFPBGA package offer extends to gate array ASICs with 48 to 144 balls, with corresponding package lengths of just 4.38 mm to 7 mm. A mere 0.65 mm high, TFPBGA packages also have an extremely low profile. They are easily implemented wherever space is at a premium, like MMC cards or memory sticks.

The target markets for custom logic devices in TFPBGA packages include a wide range of industrial, security, and consumer applications.

The inexpensive TFPBGA packages are RoHS-compliant and are available with NEC Electronics’ popular CMOS-N5, CMOS-9HD and CMOS-10HD gate array series.

For more details please visit www.eu.necel.com/tfpbga.

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