NEC Electronics Europe Introduces New PowerMOSFET for Li-Ion Battery-Packs and DC/DC Converters

NEC Electronics Europe, today announced the availability of two new PowerMOSFET families. The µPA273xUT1A family is designed for use in the protection circuitry of lithium-ion (Li-Ion) batteries for notebook PCs, and is designed to help prevent heat generation and explosions that may result from Li-Ion battery overcurrent. The second, the µPA272xUT1A family, helps to power CPUs and chipsets in notebooks, desktop PCs and servers, and is designed for use in DC/DC converters, or point-of-load (POL) converters, which must provide clean and reliable power service to chipsets. All of the new PowerMOSFET are housed in NEC Electronics’ proprietary 8-pin HVSON-8 package that fits into the industry-standard SOP-8 footprint and provides efficient heat dissipation while allowing the devices to deliver significantly more power than standard SOP-8-based solutions.

The new, highly efficient power PowerMOSFET meet the industry’s most stringent power requirements in high-speed computing applications by combining large current capabilities and high-speed switching performance with low on-state resistance. This combined functionality delivers the performance designers demand and the certitude they need to be assured that heat generation is being effectively minimized. As such, they can now leverage our devices to develop system solutions suitable for today’s demanding portable market.Fabricated with a 0.25-micron process, the PowerMOSFET have maximum on-resistances R DS(ON) max ranging from 2.2 to 9.6 mOhm in the µPA272xUT1A family, and from 3.3 to 3.7 mOhm in the µPA273xUT1A family. The devices also offer superior heat dissipation, allowing 4.6 W . Unlike lead-frame packages, which are mounted and then covered with resin, the HVSON-8 package effectively prevents heat generation by connecting directly to the board, allowing heat to radiate via an exposed frame without the use of resin. As a result, 4.6W power dissipation is available, more than twice as comparable, existing PowerMOSFET. Furthermore, without the need for resin, package height can be reduced to a maximum of 1 mm, 40 percent thinner than common PowerMOSFET, making it possible for designers to reduce the size of battery-packs e.g. in notebook computers. 

More information about the new PowerMOSFET and other Power Semiconductor devices of NEC Electronics can be found at http://www.eu.necel.com/products/powermosfet.